Part Number | XCZU11EG-L1FFVC1760I | Hiersteller | Xilinx |
---|---|---|---|
Beschreiwung | IC FPGA 512 I/O 1760FCBGA | Bleif Free Status / RoHS Status | Bleif gratis / RoHS kompatibel |
Quantitéit Verfügt | 15 pcs | Datenlabel | XCZU11EG-L1FFVC1760I.pdf |
Supplier Device Package | 1760-FCBGA (42.5x42.5) | Speed | 500MHz, 600MHz, 1.2GHz |
Serie | Zynq® UltraScale+™ MPSoC EG | RAM Gréisst | 256KB |
Primäre Attributer | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | Peripheralien | DMA, WDT |
Verpakung | Tray | Package / Case | 1760-BBGA, FCBGA |
Operatioun Temperatur | -40°C ~ 100°C (TJ) | Zuel vun I / O | 512 |
Feuchtigkeit Sensibilitéitniveau (MSL) | 4 (72 Hours) | Fabrik Standard Lead Time | 10 Weeks |
Bleif Free Status / RoHS Status | Lead free / RoHS Compliant | Flash Size | - |
Detailbeschreiwung | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 653K+ Logic Cells 256KB 500MHz, 600MHz, 1.2GHz 1760-FCBGA (42.5x42.5) | Core Prozessor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Konnektivitéit | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Architektur | MCU, FPGA |
FEDEX | www.FedEx.com | Vun $ 35,00 Basis Versandkäschten hänke vun Zone a Land of. |
---|---|---|
DHL | www.DHL.com | Vun $ 35,00 Basis Versandkäschten hänke vun Zone a Land of. |
UPS | www.UPS.com | Vun $ 35,00 Basis Versandkäschten hänke vun Zone a Land of. |
TNT | www.TNT.com | Vun $ 35,00 Basis Versandkäschten hänke vun Zone a Land of. |